Basic Info.
Model NO.
009-001
Transparency
Transparent
Hardness
Soft
Molding method
Blow Molding
Plastic Processed
PU
Product Type
Extrusion Molding Machine
Feeding Mode
Multiple Feed
Assembly Structure
Integral Type Extruder
Screw
Multi-Screw
Engagement System
Intermeshing
Screw Channel Structure
Deep Screw
Exhaust
Exhaust
Automation
Automatic
Computerized
Computerized
Transport Package
100kgs/Pack
Specification
100kgs
Trademark
PEPSON
Origin
Shenzhen
HS Code
3926901000
Production Capacity
1000000000kgs Per Year
Product Description
Our TPU film have many kinds of series, such as transparent colored and textured, flocking series, medical treatment series,sewing-free craftsmanship, TPU shoes material series, waterproof and breathable TPU film, TPU waterproof zipper film series,Tpu high/normal temperature resistance series, TPU sport film and inflatable film series, TPU plating/laser series, TPU mould proof/antibacterial/antistatic series, TPU foam series.
TPU high and low temperature film-hot-met adhesive,TPU waterproof and breathable film-high breathable film( high breathable,middle breathable and low breathable)
All the TPU film series made by our company can pass the tests according to clients' different requirements (such as SVHC, FDA, EN71-1 and EN-71-3)
Description
| 1. color Transparent & semitransparent Material Name: semitransparent widh: 39"&54" Thickness: 0.05mm-4.0mm Color: color avaiable hardness: shoure 70A~95A±3A Description: good yellow resistance Easy H/F welding & molding Application: Logo, bag;H/F welding; shoes |
Specifications
No Sew TPU Hot Melt Adhesive Film
Outstanding quality, Reasonable price
Product diversity,Fast delivery, Technical support
No Sew TPU Hot Melt Adhesive Film
Application
1. Cut the hot melt adhesive film with release paper in advance to be the proper shape to match the substrates .
2. Place the substrate on the plate of heat transferring device, bonding face up.
3. Put the hot melt adhesive film on the substrate with film side down.
4. Preheating with the condition 120 -150 ºC*1-2 sec*9.8kgf/cm2, then peel off the release paper.
5. Place on another substrate need to be bonded, hot press them together with the condition : 120-150 ºC*10-20 sec*9.8kgf/cm2.
note:
1.The conditions of hot press process should be adjusted according to the thickness of substrates or hot melt adhesive film, i e, thicker materials need longer time or higher pressure as well as hot melt adhesive film need.
2.For specific request from customers, the hot melt adhesive film need specific properties . Accordingly the application conditions will be different.